Cadence partners with TSMC to speed up chip development with agentic design

Cadence expands TSMC partnership for AI chip design on N3/N2/A16/A14, adding agentic AI and certified flows to cut iterations and speed tapeouts—read more.
Kennesaw State University

Engineering, game design faculty turn nuclear science into interactive learning experience

At Kennesaw State University, learning about nuclear energy isn’t limited to textbooks and lectures. Researchers are ...

Game changer: Designer tells city boards sports complex will be 'stunning'

Members of two Joplin boards reviewed design details for Joplin’s future Prospect Village sports complex this week, asking ...
VoxelMatters

CUPRA brings “Beyond the Known” to Milan Design Week 2026 with an exploration of parametric design

Explore CUPRA at Milan Design Week 2026, showcasing innovative design and material experimentation for the future of ...
Fabbaloo

The Beginning of Prompt-Based Manufacturing? A Look at Wonder 3D

Charles R. Goulding and Andressa Bonafe highlight how AI-driven tools like Wonder 3D are speeding up design workflows while ...